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Ayar Labs and Weiyin Partner to Redesign AI Rack with Optical Interconnect for Slimmer Architecture

Today, ultra-large-scale data centers pursuing extreme efficiency are finding that traditional copper-based electrical interconnects are hitting physical bottlenecks. To overcome this challenge, Ayar Labs, a leading CPO (Co-Packaged Optics) company, and Wiwynn have announced a deep strategic partnership. The two companies will combine cutting-edge optical technology with next-generation rack architectures to jointly develop an optical interconnect system designed for the AI era, directly addressing bandwidth and power consumption challenges when handling massive data flows within racks.
Core Technology: Optical In, Copper Out, Vertical Expansion
This partnership focuses on Scale-Up (Vertical Expansion) within the rack. High-speed electrical transmission suffers from substantial signal loss, whereas Ayar Labs' CPO technology stack—including the SuperNova laser and TeraPHY optical engine—enables optical signal conversion directly at the chip packaging level.
Low Latency and High Bandwidth: Optical interconnects deliver significantly higher throughput than traditional solutions, meeting the strict communication requirements between ASICs within a rack for large model training.
Energy Efficiency: By cutting energy loss from signal attenuation, it markedly improves the Power Usage Effectiveness (PUE) of data centers.
Overcoming Deployment Challenges: From Cooling to Manufacturing
The Ayar Labs-Wiwynn collaboration extends beyond theory to tackle real-world pain points in ultra-large-scale deployment:
Fiber Management and Integration: How to efficiently arrange complex fiber connections within the confined rack space.
Thermal Management Challenges: Leveraging Wiwynn's advanced all-liquid-cooled AI system to address heat dissipation for high-performance chips and optical components.
Manufacturing Feasibility: Using standardized processes to transform complex CPO technology into mass-producible industrial products.
The two companies plan to showcase this cutting-edge achievement at OFC 2026 (Optical Fiber Communication Conference) from the 15th to the 19th of this month. Alongside this, they will unveil the rack architecture supporting HVDC (High-Voltage Direct Current) power supply and the full liquid-cooled AI reference design.
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Today, ultra-large-scale data centers pursuing extreme efficiency are finding that traditional copper-based electrical interconnects are hitting physical bottlenecks. To overcome this challenge, Ayar Labs, a leading CPO (Co-Packaged Optics) company, and Wiwynn have announced a deep strategic partnership. The two companies will combine cutting-edge optical technology with next-generation rack architectures to jointly develop an optical interconnect system designed for the AI era, directly addressing bandwidth and power consumption challenges when handling massive data flows within racks.
Core Technology: Optical In, Copper Out, Vertical Expansion
This partnership focuses on Scale-Up (Vertical Expansion) within the rack. High-speed electrical transmission suffers from substantial signal loss, whereas Ayar Labs' CPO technology stack—including the SuperNova laser and TeraPHY optical engine—enables optical signal conversion directly at the chip packaging level.
Low Latency and High Bandwidth: Optical interconnects deliver significantly higher throughput than traditional solutions, meeting the strict communication requirements between ASICs within a rack for large model training.
Energy Efficiency: By cutting energy loss from signal attenuation, it markedly improves the Power Usage Effectiveness (PUE) of data centers.
Overcoming Deployment Challenges: From Cooling to Manufacturing
The Ayar Labs-Wiwynn collaboration extends beyond theory to tackle real-world pain points in ultra-large-scale deployment:
Fiber Management and Integration: How to efficiently arrange complex fiber connections within the confined rack space.
Thermal Management Challenges: Leveraging Wiwynn's advanced all-liquid-cooled AI system to address heat dissipation for high-performance chips and optical components.
Manufacturing Feasibility: Using standardized processes to transform complex CPO technology into mass-producible industrial products.
The two companies plan to showcase this cutting-edge achievement at OFC 2026 (Optical Fiber Communication Conference) from the 15th to the 19th of this month. Alongside this, they will unveil the rack architecture supporting HVDC (High-Voltage Direct Current) power supply and the full liquid-cooled AI reference design.
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